1、 毕业设计论文毕业设计论文 作者 学号 系部 机电学院 专业 表面贴装技术 题目 焊料的无铅化及可靠性问题 指导教师 评阅教师 完成时间：2004 年 04 月 30 日 毕毕业设计业设计( (论文论文) )中文摘要中文摘要 题目：焊料的无铅化及可靠性问题 摘要：随着人们环保意识的增强，绿色、环保已成为越来越多的行业的一项重要指 标。现已经有相关法规要求电子行业限制和禁止使用一些危害健康和破坏环境的物 质，其中就包括铅。在电子行业中，铅的一项重要用途是 Sn-Pb 焊料。目前焊料的 无铅化已成为一个广泛被研究的课题，但要找到能完全替代物理和机械性能都很优 越的传统 Sn-Pb 焊料的无铅焊料，
2、有很多问题需要解决，最大的一个就是可靠性问 题。因为焊点的质量与可靠性很大程度决定了电子产品的质量。无铅焊点由于焊料 的差异和焊接工艺参数的调整，必不可少的会给焊点可靠性带来新的问题，所以研 究仍得继续，才能推动无铅化进程。 关键词：焊料 无铅化 可靠性 毕业设计毕业设计( (论文论文) )外文摘要外文摘要 TitleTitle : : The Problem Of Solders Lead-Free and Reliability Abstract: As peoples awareness of environmental protection increases, green and e
3、nvironmental protection have become an important indicator of more and more industries.In the electronics industry the relevant legal requirements were already made to limit and prohibit the use of a number substances which are damage to health and environment including lead. In the electronics indu
4、stry, an important use of lead is Sn-Pb solder. The current lead-free solder has become a widely studied topic, but finding a kind of lead-free solder which is able to completely replace traditional Sn-Pb solder, there are many problems to solve. the biggest one is the issue of reliablity. Because the solder joint quality and reliability to a large extent determines the qual
